Conductive Pastes

IDTechEx Printed Electronics Technical Development Materials Award for the most significant technical development over the last 24 months (February 2007 - February 2009) in the field of printed electronics awarded to ANI for the creation of an inkjettable conductive copper ink that can be processed in air with a drying temperature at under 100C.

ANI’s metallic pastes are formulated for high viscosity printing technologies, such as screen printing, which are capable of printing thick lines and patterns.  ANI has demonstrated pastes for use on diverse substrates including Kapton®, PET, glass, and silicon.  Due to the unique properties of nanometric metals, such as their large surface area and low melting point, the pastes can be sintered or photosintered to form conductors at substrate and component compatible temperatures. Our pastes can be tailored to user specifications by formulating to suit various processing conditions and requirements. We work with customers to provide a total printing solution customized for specific application needs. For more information please contact sales(at)appliednanotech.net

 ANI Nanoparticle Copper Paste

ANI’s copper pastes can be used to create high conductivity patterns for applications in the printed electronics industry. [Read more]

ANI Aluminum Paste

ANI’s aluminum pastes are tailored for conductive applications in the silicon photovoltaics industry.  Without the use of glass frits, our Al-iP1000 paste can achieve diffusion through passivation layers on silicon wafers.  [Read more]

ANI Aluminum Alloy Paste

ANI Al-iP4000 aluminum alloy paste is formulated for screen printing techniques. This paste is designed for silicon wafer-based photovoltaic applications. Al-iP4000 shows low contact resistance on n-type and p-type Si solar cells.  [Read more]

ANI Micro Silver Paste

ANI’s Micro silver paste are tailored for conductive applications in the silicon photovoltaics industry.  Our Ag-iM100 paste can achieve diffusion through passivation layers on silicon wafers.  [Read more]

ANI Photovoltaic Silver paste

Ag–iPV8000 is a silver paste suitable for front side contact applications in the solar industry. Ag–iPV8000 is screen printed and thermally cured to form front contact patterns on silicon wafer substrates.  [Read more]

ANI Micro Copper Paste

Our copper paste technology is poised to replace the industry standard silver and gold based pastes for price sensitive applications in the printed electronics industry. We have solved many technical issues that have prevented our competitors from commercializing copper based pastes. [Read More...]

Inquiries

If you have an application or development program that would benefit from our pastes and printing expertise, please fill out our Information Request Form or contact us at sales(at)appliednanotech.net.

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