ANI Nanoparticle Copper Inks
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| Cu-iJ70 copper ink technology has been recognized as one of the 100 most significant innovations of 2010 by R&D Magazine. |
Our copper ink technology is poised to replace the industry standard silver and gold based inks for price sensitive applications in the printed electronics industry. We have solved many technical issues that have prevented our competitors from commercializing copper based inks. Our copper inks offer several advantages:
- can be patterned using inkjet and other additive printing technologies,
- can be rapidly sintered at room temperature,
- low cost and low melting point flexible polymer substrates can be used, and
- processing can be conducted in ambient air environment making it easier to integrated into high volume production lines.
| Cu-iJ70 Product Specifications: | |
|---|---|
| Particle size | 20-100 nm |
| Resistivity | 5-7 µΩ-cm |
| Solid content | 40 wt%* |
| Viscosity | 8-18 cP** |
| Surface tension | 17-21 mN/m |
| Solvent | Organic |
* Available from 10-40 wt% |
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The Cu-iJ70 ink has particle sizes ranging from 20-100nm with an average of 70nm. The solid content weight is 40%. We also offer customized inks from 10-40% weight loadings based on customer requirements. The final resistivity of the cured ink is 5-7 μΩ-cm, suitable for most electronic applications.
Inquiries
If you have an application or development program that would benefit from our ink and ink expertise, please fill out our Information Request Form
or contact us at sales(at)appliednanotech.net.