ANI Copper Pastes
ANI’s copper pastes can be used to create high conductivity patterns for applications in the printed electronics industry. ANI’s Cu-iJ70P paste is printed and thermally sintered to form conductive patterns on substrates such as glass, ceramics, and Kapton®. Cu-iJ70P has a high solid content with the small particle size enabling the printing of thick lines and patterns with rapid low energy curing.
| Cu-iJ70P Preliminary Specifications: | |
|---|---|
| Particle size | 40-100 nm |
| Resistivity | 7-60 µΩ-cm |
| Solid content | 60 wt% |
| Viscosity | 30,000-40,000 cP* |
| Solvent | Organic |
* Measured at 12 rpm and 25C with Brookfield LV-I+ viscometer |
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Inquiries
If you have an application or development program that would benefit from our pastes and inks and printing expertise, please fill out our Information Request Form or contact us at sales(at)appliednanotech.net.